High-Speed Communication ｘ Teijin Resin

The introduction of next-generation communication technologies will enable high-speed, large-volume data transmission and reception, and the realization of an IoT society based on 5G is expected to dramatically change our lives.
Teijin Resin & Plastic Processing Business Unit provides materials with various characteristics αs a material supplier that supports the IoT society.
In order to respond to increased communication traffic, faster processing speeds, and downsizing, in addition to the excellent impact resistance and flame resistance of conventional polycarbonate, we are developing products with excellent thermal conductivity and low dielectric property. Consult Teijin for advice on day-to-day challenges.

Teijin’s advantage in the high-speed communication field

1.Areas of Expertise

Main applications

Heat Sink
Outdoor communication equipment
(Radome, etc.)
Local IoT/5G products
Transparent film antenna
MID

Major customers

Domestic and overseas telecommunication equipment manufacturers

2.Services

New heat dissipation design with thermal conductive materials and thermal analysis support
Development of dielectric control and electromagnetic wave shielding materials that realize next-generation communication society using high-frequency radio waves
Reduced deterioration of weather resistance, making it suitable for outdoor use
Improved design and weight reduction by substituting metal for equipment housings
Miniaturization od MID enabling downsizing and reduction of the number of parts

3.Product Capabilities

We provide required functions for high-speed communication equipment

Insulation
High thermal conductivity(heat dissipation)
High heat resistance
Color design
Resin-metal bondability
Low dielectric
Electromagnetic shielding
Long-term reliability
Circuit plating

Application

Panlite® & Multilon®

High-Speed Communication Grade Lineup

Applications/Features	PC			PC/ABS
Applications/Features	Flame resistance High impact resistance	Flame resistance Thermal conduction Insulation	Thermal conduction Conductivity	Flame resistance High impact resistance High Flow	Thermal conduction Conductivity
Exteriors(Indoor)	LN-2520A MN-3600HC	DN-5327BZ		TN-7000A TN-7297
Exteriors(Outdoor)	LN-3520ZH MXN-3201Z	XJ-0860(Under development)		TN-7500NZ
Heat Sink			HV-2500KE		H-3500KE

Applications/Features	PC
Applications/Features	Low dielectric			EMC Shield
Radome	XJ-0723 (Under development)
Film Antenna		W-0198(Under development) SH-1126Z
MID			GYV-3520A
Shield Case				E-8910 EN-8615N

PURE-ACE® Polycarbonate Films

Applications/Features	PC
Applications/Features	Optical isotropy Heat resistance Optical use
Transparent Film	D-series、L‐series (Thickness : 25～100μm)

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[High-Speed Communication] Thermal conductive materials for next-generation communication equipment(Go to Download Form)

Due to increased communication volume and faster processing speeds, the amount of heat generated by electronic components tend to increas in next-generation Communication equipment.
Introducing the thermal conductivity grade developed by Teijin.

[High-Speed Communication] Low-dielectric materials for for next-generation communication equipment(Go to Download Form)

Low dielectric grade developed by Teijin for stabilizing radio waves in the 5G communication band.

[High-Speed Communication] Materials for exterior of outdoor application(Go to Download Form)

Material with excellent low-temperature impact resistance and UVresistance, developed for the exterior of applications installed in harsher outdoor environments.

[High-Speed Communication] Non-brominated flame resistance materials for communication equipment housing(Go to Download Form)

Non-brominated flame resistance materials with high flowability during molding while maintaining high level of impact resistance , ideal for communication equipment housing, etc.

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