High-Speed Communication ｘ Teijin Resin
The introduction of next-generation communication technologies will enable high-speed, large-volume data transmission and reception, and the realization of an IoT society based on 5G is expected to dramatically change our lives.
Teijin Resin & Plastic Processing Business Unit provides materials with various characteristics αs a material supplier that supports the IoT society.
In order to respond to increased communication traffic, faster processing speeds, and downsizing, in addition to the excellent impact resistance and flame resistance of conventional polycarbonate, we are developing products with excellent thermal conductivity and low dielectric property.
Consult Teijin for advice on day-to-day challenges.
Teijin’s advantage in the high-speed communication field
1.Areas of Expertise
Main applications
- Heat Sink
- Outdoor communication equipment
(Radome, etc.) - Local IoT/5G products
- Transparent film antenna
- MID
Major customers
- Domestic and overseas telecommunication equipment manufacturers
2.Services
- New heat dissipation design with thermal conductive materials and thermal analysis support
- Development of dielectric control and electromagnetic wave shielding materials that realize next-generation communication society using high-frequency radio waves
- Reduced deterioration of weather resistance, making it suitable for outdoor use
- Improved design and weight reduction by substituting metal for equipment housings
- Miniaturization od MID enabling downsizing and reduction of the number of parts
3.Product Capabilities
We provide required functions for high-speed communication equipment
- Insulation
- High thermal conductivity(heat dissipation)
- High heat resistance
- Color design
- Resin-metal bondability
- Low dielectric
- Electromagnetic shielding
- Long-term reliability
- Circuit plating
Application
High-Speed Communication Grade Lineup
Panlite® & Multilon®
| Applications/Features | PC | PC/ABS | |||
|---|---|---|---|---|---|
| Flame resistance High impact resistance |
Flame resistance Thermal conduction Insulation |
Thermal conduction Conductivity |
Flame resistance High impact resistance High Flow |
Thermal conduction Conductivity |
|
| Exteriors(Indoor) | LN-2520A MN-3600HC |
DN-5327BZ | TN-7000A TN-7297 |
||
| Exteriors(Outdoor) | LN-3520ZH MXN-3201Z |
XJ-0860(Under development) | TN-7500NZ | ||
| Heat Sink | HV-2500KE | H-3500KE | |||
| Applications/Features | PC | |||
|---|---|---|---|---|
| Low dielectric | EMC Shield | |||
| Radome | XJ-0723 (Under development) |
|||
| Film Antenna | W-0198(Under development) SH-1126Z |
|||
| MID | GYV-3520A | |||
| Shield Case | E-8910 EN-8615N |
|||
PURE-ACE® Polycarbonate Films
| Applications/Features | PC |
|---|---|
| Optical isotropy Heat resistance Optical use |
|
| Transparent Film | D-series、L‐series (Thickness : 25～100μm) |
