High-Speed Communication ｘ Teijin Resin
With the adoption of next-generation communication technologies compliant with Wi-Fi 7 standards, our lives are expected to change dramatically. At Teijin Resin & Plastic Processing Business Unit, we provide materials that support the IoT society, offering products with excellent impact resistance, flame retardancy, thermal conductivity, and low dielectric properties.
In response to the increased communication volume and faster processing speeds brought about by the spread of generative AI, we have developed thermal conductive grades to reduce heat generation from electronic components and low dielectric grades to stabilize signals in the 5G communication band. We also offer products with superior low-temperature impact resistance and UV resistance to withstand harsh outdoor environments.
Teijin is your trusted partner for solving everyday material challenges — let us help you find the right solution.
Teijin’s advantage in the high-speed communication field
1.Areas of Expertise
Main applications
- Heat Sink
- Outdoor communication equipment
(Radome, etc.) - Local IoT/5G products
- Transparent film antenna
- MID
Major customers
- Domestic and overseas telecommunication equipment manufacturers
2.Services
- Enhanced Heat Dissipation through Thermal Conductive Materials and Metal Joining Technology
- Development of dielectric control and electromagnetic wave shielding materials that realize next-generation communication society using high-frequency radio waves
- Reduced deterioration of weather resistance, making it suitable for outdoor use
- Improved design and weight reduction by substituting metal for equipment housings
- Miniaturization od MID enabling downsizing and reduction of the number of parts
3.Product Capabilities
We provide required functions for high-speed communication equipment
- Insulation
- High thermal conductivity(heat dissipation)
- High heat resistance
- Color design
- Resin-metal bondability
- Low dielectric
- Electromagnetic shielding
- Long-term reliability
- Circuit plating
Application
High-Speed Communication Grade Lineup
Panlite® & Multilon®
| Applications/Features | PC | PC/ABS | ||||
|---|---|---|---|---|---|---|
| Flame resistance High impact resistance |
Flame resistance Thermal conduction Insulation |
Thermal conduction Conductivity |
Flame resistance High impact resistance High Flow |
Thermal conduction Conductivity |
Recycle | |
| Exteriors(Indoor) | LN-2520A MN-3600HC |
DN-5327BZ XJ-1236 (Under development) XJ-1250 (Under development) |
TN-7000A TN-7297 |
TNA-F7400*2 TNA-K7400*2 TNA-F7600*2 TNA-K-7600*2 |
||
| Exteriors(Outdoor) | LN-3520ZH*1 MXN-3201Z*1 MW-4220Z*1 |
DN-5328BZ*1 | TN-7570Z | TNA-F7800Z*2 TNA-K7800Z*2 |
||
| Heat Sink | HV-1700KE HV-2500KE H-4000KE |
H-3500KE | ||||
*1 UL746C f1 certification *2 PCR Content Ratio (F: 30%, K: 50%)
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| Applications/Features | PC | ||
|---|---|---|---|
| Low dielectric | Flame resistance High impact resistance |
EMI Shield | |
| Radome | MN-1200Z SH-1126Z |
MW-4220Z | |
| Shield Case | E-8910 E-8912BA EN-8615N |
||
| Film Antenna | W-0198 (Under development) | ||
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PURE-ACE® Polycarbonate Films
| Applications/Features | PC |
|---|---|
| Optical isotropy Heat resistance Optical use |
|
| Transparent Film | D-series、L‐series (Thickness : 25～100μm) |
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Related information
Products
Polycarbonte (PC) Resin Panlite® & Multilon®
Panlite® has many notable features such as impact resistance, heat resistance, dimensional stability, electrical properties, transparency and sanitation. Multilon® combines the features of polycarbonate resin (PC) and acrylonitrile-butadiene-styrene (ABS) resin, and is used in a wide range of fields, including electrical / electronics, OA, automobiles, medical care, and lighting.
Polycarbonate Film for Optical Use PURE-ACE®
A high-quality polycarbonate film produced in clean facility. Optical isotropic and retardation lineups are available.
Technology
Polycarbonate resin Panlite® for transparent, low dielectric
Teijin has developed a transparent polycarbonate with excellent dielectric properties for use in devices compatible with high frequency bands.
Polycarbonate resin Panlite® for metal joining
Teijin has developed a non-crystalline, non-reinforced metal-bondable polycarbonate resin using its resin development technology and Daicel Miraizu Ltd. metal dissimilar material joining technology called "DLAMP®".
Polycarbonate resin Panlite® for LDS
Teijin has developed a low dielectric polycarbonate resin that excels in supporting the Laser Direct Structuring (LDS) method, which is one of the processing techniques for 3D circuitry (Molded Interconnect Devices - MID). This resin offers excellent low dielectric properties, enabling lightweighting, thinning, and greater design flexibility of devices while minimizing transmission losses.