Polycarbonate resin Panlite® for transparent, low dielectric
Teijin has developed a transparent polycarbonate with excellent dielectric properties for use in devices compatible with high frequency bands.
Introduction
5G and 6G communications require signal transmission in high frequency bands. Furthermore, low dielectric (Low-K) properties are required to reduce signal attenuation and achieve efficient communication. On the other hand, in high frequency bands, the propagation distance of radio waves is shorter, so more antennas need to be installed. There is now a growing demand for communication equipment that do not spoil the scenery and design.
Teijin‘s newly developed transparent, low dielectric polycarbonate has superior dielectric properties compared to conventional polycarbonates and is maintain transparency. It is ideal for applications requiring transparency such as antennas, displays, and vehicle antennas. This film-formed material not only offers beautiful designs and an appearance that blends in with the environment, but also provides excellent workability thanks to its flexibility and ability to a variety of shapes, and its low dielectric properties minimize loss in radio wave propagation. Transparent film antennas are expected to play a key role in the deployment of next-generation communication technologies such as 5G and 6G in urban and complex environments due to their efficiency and functionality.
【Application】
Lineup
Transparent, low dielectric polycarbonate
Grade | Feature | Dielectric constant*1 | Dielectric tangent*1 | Load-deflection temperature*2 |
---|---|---|---|---|
SH-1126Z | Moldability | 2.66 | 0.0025 | 113℃ |
W-0197 (under development) |
Heat resistant | 2.59 | 0.0028 | 151℃ |
W-0198 (under development) |
Low dielectric | 2.60 | 0.0015 | 127℃ |
Ref: General-purpose polycarbonate | 2.71 | 0.005 | 125℃ |
- *1【Test Device】Network analyzer N522B(Keysight Technologies),Cavity Resonator(Kanto Electronics Application &
Development Inc.)
【Test Condition】Frequency(5GHz(TM mode))、Temp. 25℃ - *2Compliant with ISO75-1/2 Load 1.80MPa
Expanding Film Applications with Panlite® Film U-Series(under development)
Features
- Design:
It allows for beautiful designs and an appearance that blends in with the surrounding environment. - Flexibility:
It is easy to bend and can be adapted to variety of shapes, allowing for greater freedom in installation. - Low dielectric properties:
This enables efficient communication with less loss in radio wave propagation.
Related information
The introduction of next-generation communication technologies will enable high-speed, large-volume data transmission and reception, and the realization of an IoT society based on 5G is expected to dramatically change our lives.
Teijin Resin & Plastic Processing Business Unit provides materials with various characteristics αs a material supplier that supports the IoT society.